Electronic apparatus and method for fabricating the same

ABSTRACT

An electronic apparatus includes a first electronic part with a first terminal, a second electronic part with a second terminal opposite the first terminal, and a joining portion which joins the first terminal and the second terminal. The joining portion contains a pole-like compound extending in a direction in which the first terminal and the second terminal are opposite to each other. The joining portion contains the pole-like compound, so the strength of the joining portion is improved. When the first terminal and the second terminal are joined, the temperature of one of the first electronic part and the second electronic part is made higher than that of the other. A joining material is cooled and solidified in this state. By doing so, the pole-like compound is formed.

CROSS-REFERENCE TO RELATED APPLICATION

This application is based upon and claims the benefit of priority of theprior Japanese Patent Application No. 2013-254372, filed on Dec. 9,2013, the entire contents of which are incorporated herein by reference.

FIELD

The embodiments discussed herein are related to an electronic apparatusand an electronic apparatus fabrication method.

BACKGROUND

The technique of electrically connecting terminals of electronic partsby joining them by the use of a joining material is known. For example,solder which contains one or more kinds of components is used as ajoining material. For example, the technique of mounting a semiconductorelement or a semiconductor package over a board, such as a printedboard, by the use of solder bumps is known.

Japanese Laid-open Patent Publication No. 2002-239780

Japanese Laid-open Patent Publication No. 2007-242783

A joining failure, such as a crack, peel, or disconnection, may occur ina joining portion between terminals of electronic parts due to impactfrom the outside or a thermal stress created by heat generated by theelectronic parts or heat applied to the electronic parts.

SUMMARY

According to an aspect, there is provided an electronic apparatusincluding a first electronic part with a first terminal, a secondelectronic part with a second terminal opposite the first terminal, anda joining portion which joins the first terminal and the second terminaland which contains a first pole-like compound extending in a directionin which the first terminal and the second terminal are opposite to eachother.

The object and advantages of the invention will be realized and attainedby means of the elements and combinations particularly pointed out inthe claims.

It is to be understood that both the foregoing general description andthe following detailed description are exemplary and explanatory and arenot restrictive of the invention.

BRIEF DESCRIPTION OF DRAWINGS

FIG. 1 illustrates an example of an electronic apparatus according to afirst embodiment;

FIGS. 2A, 2B, and 2C illustrate an example of an electronic part joiningprocess according to the first embodiment;

FIG. 3 illustrates an example of the structure of a semiconductorelement;

FIG. 4 illustrates an example of the structure of a semiconductorpackage (part 1);

FIG. 5 illustrates an example of the structure of a semiconductorpackage (part 2);

FIG. 6 illustrates an example of the structure of a semiconductorpackage (part 3);

FIGS. 7A and 7B illustrate examples of the structure of a circuit board;

FIGS. 8A, 8B, and 8C illustrate an example of an electronic part joiningprocess according to a second embodiment;

FIG. 9 illustrates a first example of the structure of an electronicapparatus according to the second embodiment;

FIGS. 10A and 10B illustrate a second example of the structure of theelectronic apparatus according to the second embodiment;

FIGS. 11A, 11B, and 11C illustrate an example of an electronic partjoining process according to a third embodiment;

FIG. 12 illustrates a first example of the structure of an electronicapparatus according to the third embodiment;

FIGS. 13A and 13B illustrate a second example of the structure of theelectronic apparatus according to the third embodiment;

FIGS. 14A, 14B, and 14C illustrate an example of an electronic partjoining process according to a fourth embodiment;

FIG. 15 is a view for describing another example of the electronic partjoining process according to the fourth embodiment (part 1);

FIG. 16 is a view for describing another example of the electronic partjoining process according to the fourth embodiment (part 2);

FIG. 17 is a view for describing another example of the electronic partjoining process according to the fourth embodiment (part 3); and

FIG. 18 illustrates an example of an apparatus for fabricating anelectronic apparatus.

DESCRIPTION OF EMBODIMENTS

A first embodiment will be described first.

FIG. 1 illustrates an example of an electronic apparatus according to afirst embodiment. FIG. 1 is a fragmentary schematic sectional view of anexample of an electronic apparatus according to a first embodiment.

An electronic apparatus 1 illustrated in FIG. 1 includes an electronicpart 10, an electronic part 20, and a joining portion 30 which joins theelectronic part 10 and the electronic part 20.

The electronic part 10 has a terminal 11 formed over a surface 10 a. Inthe example of FIG. 1, one terminal 11 is illustrated.

The electronic part 20 is disposed opposite the electronic part 10. Theelectronic part 20 has a terminal 21 formed over a surface 20 a oppositethe surface 10 a of the electronic part 10. In the example of FIG. 1,one terminal 21 is illustrated. The terminal 21 of the electronic part20 is formed at a position corresponding to the terminal 11 of theelectronic part 10.

The joining portion 30 is formed between the terminal 11 of theelectronic part 10 and the terminal 21 of the electronic part 20 andjoins the terminal 11 and the terminal 21.

A semiconductor element (semiconductor chip), a semiconductor packageincluding a semiconductor element, a circuit board, or the like is usedas each of the electronic part 10 and the electronic part 20. Thedetails of the structure of each of the electronic part 10 and theelectronic part 20 will be described later.

Solder is used for forming the joining portion 30 which joins theelectronic part 10 and the electronic part 20. Solder which contains tin(Sn) is used. For example, Pb-free solder which does not contain lead(Pb) is used. For example, Sn—Ag based solder which contains Sn andsilver (Ag) is used for forming the joining portion 30. For example,Sn—Ag based solder which contains 0.5 wt % or more of Ag is used.

In the electronic apparatus 1, the joining portion 30 contains apole-like compound 31 which extends in a direction in which the terminal11 of the electronic part 10 and the terminal 21 of the electronic part20 are opposite to each other (in a direction from a terminal 11 side toa terminal 21 side or in a direction from the terminal 21 side to theterminal 11 side). For example, if the above Sn—Ag based solder is usedfor forming the joining portion 30, then the joining portion 30 containsthe pole-like compound 31 which is Ag₃Sn (IMC (InterMetallic Compound)).

The pole-like compound 31 is formed in the process of joining theelectronic part 10 and the electronic part 20 by the use of a material(joining material) of which the joining portion 30 is formed.

FIGS. 2A, 2B, and 2C illustrate an example of an electronic part joiningprocess according to the first embodiment. Each of FIGS. 2A, 2B, and 2Cis a fragmentary schematic sectional view of an example of an electronicpart joining process according to the first embodiment. FIG. 2Aillustrates an example of a state before joining. FIG. 2B illustrates anexample of a state at joining time. FIG. 2C illustrates an example of astate after joining.

First the electronic part 10 and the electronic part 20 to be joinedtogether illustrated in FIG. 2A are prepared. A joining material 30 a isput in advance on a terminal of one of the electronic part 10 and theelectronic part 20 prepared. In the example of FIG. 2A, the joiningmaterial 30 a is put in advance on the terminal 21 of the electronicpart 20. The joining material 30 a is used for forming the above joiningportion 30. For example, solder is used as the joining material 30 a.Description will be given with a case where Sn—Ag based solder is usedas the joining material 30 a as an example.

The joining material 30 a on the terminal 21 of the electronic part 20illustrated in FIG. 2A is formed, for example, in the following way.Solder put on the terminal 21 by mounting a solder ball on the terminal21 or depositing solder on the terminal 21 by plating is melted byheating and is solidified by cooling. In the example of FIG. 2A, thejoining material 30 a is formed so as to have a shape close to a ball.However, there is no limit to the shape of the joining material 30 a andthe joining material 30 a may take various shapes.

After the above electronic part 10 and the above electronic part 20 onwhich the joining material 30 a is put are prepared, the terminal 11 ofthe electronic part 10 is aligned with the terminal 21 (joining material30 a) of the electronic part 20, as illustrated in FIG. 2A, to disposethem opposite each other.

As illustrated in FIG. 2B, the joining material 30 a on the terminal 21of the electronic part 20 is then melted by heating and is connected tothe terminal 11 of the electronic part 10. After the joining material 30a is connected to the terminal 11, the joining material 30 a issolidified by cooling. In this case, the joining material 30 a is heatedin a furnace in an atmosphere of an inert gas such as nitrogen (N₂). Thejoining material 30 a is cooled in a furnace in an atmosphere of aninert gas. For example, the joining material 30 a is cooled by purgingthe inside of a furnace or the joining material 30 a is allowed to coolin a furnace.

In the process of cooling the joining material 30 a after heating, anadjustment is made so as to make the temperature of one of theelectronic part 10 and the electronic part 20 higher than that of theother, for example, during at least a period from the beginning to theend of the solidification of the joining material 30 a. For example, anadjustment is made so as to make the temperature of the electronic part20 higher than that of the electronic part 10. Alternatively, anadjustment is made so as to make the temperature of the electronic part10 higher than that of the electronic part 20.

For example, a member having determined heat capacity is disposed overone of the electronic part 10 and the electronic part 20 to lower therate at which the one over which the member is disposed is cooled. Thismakes the temperature of the one electronic part higher than that of theother electronic part, for example, during a period from the beginningto the end of the solidification of the joining material 30 a.

Another method may be used. One electronic part is selectively heated tolower the rate at which the one electronic part is cooled.Alternatively, the other electronic part is selectively cooled to raisethe rate at which the other electronic part is cooled. This makes thetemperature of the one electronic part higher than that of the otherelectronic part, for example, during a period from the beginning to theend of the solidification of the joining material 30 a.

As has been described, the temperature of one electronic part is madehigher than that of the other electronic part, for example, during aperiod from the beginning to the end of the solidification of thejoining material 30 a in the process of cooling the joining material 30a after heating. By doing so, a temperature gradient is produced in thejoining material 30 a at solidification time. That is to say, thefollowing temperature gradient is produced. The temperature of thejoining material 30 a on the one electronic part side on which thetemperature is made high is higher than that of the joining material 30a on the other electronic part side. Such a temperature gradient isproduced, so the solidification of the joining material 30 a usuallyprogresses from the other electronic part side at lower temperatures tothe one electronic part side at higher temperatures.

The solidification progresses in this way. Accordingly, as illustratedin FIG. 2C, the pole-like compound 31, which is Ag₃Sn, is formed in thejoining material 30 a, which is Sn—Ag based solder, so that it willextend in the direction in which the solidification progresses, that isto say, in the direction in which the terminal 11 of the electronic part10 and the terminal 21 of the electronic part 20 are opposite to eachother. In the example of FIG. 2C, a plurality of pole-like compounds 31are illustrated. The pole-like compounds 31, which are Ag₃Sn, arecovered with a portion 32 which contains Sn and Ag contained in thejoining material 30 a. With the progress of the solidification, thejoining portion 30 which contains the pole-like compounds 31 is formedinside the portion 32. As a result, as illustrated in FIG. 2C, theelectronic apparatus 1 in which the electronic part 10 and theelectronic part 20 are joined by the joining portion 30 is obtained.

The pole-like compounds 31 extending in this way in the direction inwhich the terminal 11 of the electronic part 10 and the terminal 21 ofthe electronic part 20 are opposite to each other are formed in thejoining portion 30. The pole-like compounds 31 function like metalreinforcements, so the strength of the joining portion 30 againstexternal force or stress created by heat improves. For example, thestrength of the joining portion 30 against stress created in a directionwhich intersects the direction in which the pole-like compounds 31extend improves.

For example, with an increase in the density of semiconductor elementsmounted or a decrease in the pitch between terminals, the size ofsemiconductor elements or semiconductor packages increases or solderjoining portions between semiconductor elements or semiconductorpackages and circuit boards become minuter. As a result, larger externalforce or stress may be applied to joining portions. If the above Sn—Agbased solder is used for forming a joining portion and the above joiningmethod described in FIGS. 2A through 2C is not used, then a coarse Ag₃Sncompound may be formed in the joining portion or a pole-like Ag₃Sncompound formed in the joining portion may extend in the direction of aterminal surface. If external force or stress created by heat isconcentrated on such a compound, a crack, peel, or shear peel due toshear stress tends to appear in the joining portion with a portion ofthe compound as a starting point.

As stated above, the pole-like compounds 31 extending in the directionin which the terminal 11 of the electronic part 10 and the terminal 21of the electronic part 20 are opposite to each other are formed in thejoining portion 30 between the electronic part 10 and the electronicpart 20. By doing so, the strength of the joining portion 30 againstexternal force or stress created by heat improves. Such improvement inthe strength of the joining portion 30 effectively controls theappearance of a crack or peel in the joining portion 30 caused byexternal force or stress or a disconnection caused by such a crack orpeel.

There is no need for the formed pole-like compounds 31 to reach from theterminal 11 of the electronic part 10 to the terminal 21 of theelectronic part 20. Even if the pole-like compounds 31 are short and donot reach from the terminal 11 to the terminal 21, the presence of thepole-like compounds 31 in the joining portion 30 leads to the aboveimprovement in the strength of the joining portion 30 and the appearanceof a crack or peel is controlled. For example, the length of the abovepole-like compounds 31 formed may be half or more of the distancebetween the terminal 11 and the terminal 21.

For example, a plurality of pole-like compounds 31 are formed betweenthe terminal 11 of the electronic part 10 and the terminal 21 of theelectronic part 20 and extend in the direction in which the terminal andthe terminal 21 are opposite to each other. In this case, there is noneed for the plurality of pole-like compounds 31 to extend in parallelwith one another. Furthermore, there is no need for the plurality ofpole-like compounds 31 extending to have the same length. In addition,there is no need for the plurality of pole-like compounds 31 to extendwith positions at the same level from the surface of the terminal 11 orthe terminal 21 as starting points.

Moreover, there is no need for the joining portion 30 to contain aplurality of pole-like compounds 31. The presence of at least onepole-like compound 31 in the joining portion 30 leads to the aboveimprovement in the strength of the joining portion 30 and the appearanceof a crack or peel is controlled.

Ag₃Sn is taken as an example of the pole-like compound 31. However, thepole-like compound 31 may contain another crystal phase which containsAg and Sn. Even in that case, a pole-like compound 31 is contained, sothe above improvement in the strength of the joining portion 30 isachieved. As a result, the appearance of a crack or peel is controlled.

Furthermore, Sn—Ag based solder is taken as an example of the joiningmaterial 30 a. However, another solder may be used as the joiningmaterial 30 a. Sn—Ni based solder which contains Sn and nickel (Ni),Sn—Cu based solder which contains Sn and copper (Cu), Sn—Au based solderwhich contains Sn and gold (Au), Sn—Pd based solder which contains Snand palladium (Pd), or the like may be used as the joining material 30a. Even if one of them is used as the joining material 30 a, a joiningportion 30 which contains a pole-like compound 31 can be formed by theuse of the above joining method described in FIGS. 2A through 2C and thesame effect that is described above can be obtained by the formation ofthe pole-like compound 31. Solder used as the joining material 30 a isnot limited to solder which contains two kinds of elements.

In addition, the joining material 30 a is put in advance on the terminal21 of the electronic part 20. However, the joining material 30 a may beput in advance on the terminal 11 of the electronic part 10 to join theelectronic part 10 and the electronic part 20.

As stated above, a semiconductor element, a semiconductor packageincluding a semiconductor element, a circuit board, or the like is usedas each of the electronic part 10 and the electronic part 20. Examplesof the structure of a semiconductor element, a semiconductor package,and a circuit board will be described with reference to FIGS. 3 through7A and 7B.

FIG. 3 illustrates an example of the structure of a semiconductorelement. FIG. 3 is a fragmentary schematic sectional view of an exampleof a semiconductor element.

A semiconductor element 100 illustrated in FIG. 3 includes asemiconductor substrate 110 in which an element, such as a transistor,is formed, and a wiring layer 120 formed over the semiconductorsubstrate 110.

A silicon (Si) substrate, a germanium (Ge) substrate, a silicongermanium (SiGe) substrate, a gallium arsenide (GaAs) substrate, anindium phosphide (InP) substrate, or the like is used as thesemiconductor substrate 110. Elements, such as transistors, capacitors,and resistors, are formed in the semiconductor substrate 110. FIG. 3illustrates a MOS (Metal Oxide Semiconductor) transistor 130 as anexample of an element.

The MOS transistor 130 is formed in an element region demarcated by anisolation region 110 a formed in the semiconductor substrate 110. TheMOS transistor 130 includes a gate electrode 132 formed over thesemiconductor substrate 110 with a gate insulating film 131 between anda source region 133 and a drain region 134 formed in the semiconductorsubstrate 110 on both sides of the gate electrode 132. A spacer (sidewall) 135, which is an insulating film, is formed on the sides of thegate electrode 132.

The wiring layer 120 is formed over the semiconductor substrate 110 inwhich the above MOS transistor 130 and the like are formed. The wiringlayer 120 includes a conductor portion (wirings and vias) 121electrically connected to the MOS transistor 130 and the like formed inthe semiconductor substrate 110 and an insulating portion 122 whichcovers the conductor portion 121. FIG. 3 illustrates as an example theconductor portion 121 electrically connected to the source region 133and the drain region 134 of the MOS transistor 130. Various conductivematerials, such as Cu and aluminum (Al), are used for forming theconductor portion 121. An inorganic insulating material, such as siliconoxide, or an inorganic insulating material, such as resin, is used forforming the insulating portion 122.

The conductor portion 121 in the surface of the wiring layer 120includes portions used as terminals 121 a for external connection. Bumpsof solder or the like corresponding to the above joining material 30 a(FIGS. 2A through 2C) are put on the terminals 121 a when or before thesemiconductor element 100 is joined to another electronic part.

Each of FIGS. 4 through 6 illustrates an example of the structure of asemiconductor package. Each of FIGS. 4 through 6 is a fragmentaryschematic sectional view of an example of a semiconductor package.

First a semiconductor package 200 illustrated in FIG. 4 will bedescribed.

A semiconductor package 200 illustrated in FIG. 4 includes a packagesubstrate (circuit board) 210, a semiconductor element 220 mounted overthe package substrate 210, and a sealing layer 230 which seals thesemiconductor element 220.

A printed board or the like is used as the package substrate 210. Thepackage substrate 210 includes a conductor portion (wirings and vias)211 and an insulating portion 212 which covers the conductor portion211. Various conductive materials, such as Cu and Al, are used forforming the conductor portion 211. A resin material, such as phenolicresin, epoxy resin, or polyimide resin, a composite resin materialproduced by impregnating glass fiber or carbon fiber with such a resinmaterial, or the like is used for forming the insulating portion 212.

The semiconductor element 220 is attached and fixed over the abovepackage substrate 210 by the use of a die attach material 240, such asresin or a conductive paste, and is electrically connected (wire-bonded)to the package substrate 210 with wires 250. The semiconductor element220 and the wires 250 over the package substrate 210 are sealed by thesealing layer 230. A resin material, such as epoxy resin, a materialproduced by making such a resin material contain an insulating filler,or the like is used for forming the sealing layer 230.

The conductor portion 211 in the surface of the package substrate 210opposite the surface over which the semiconductor element 220 is mountedincludes portions used as terminals 211 a for external connection. Bumpsof solder or the like corresponding to the above joining material 30 a(FIGS. 2A through 2C) are put on the terminals 211 a when or before thesemiconductor package 200 is joined to another electronic part.

In the example of FIG. 4, the semiconductor element 220 is wire-bondedto the package substrate 210. However, the semiconductor element 220 maybe flip-chip-bonded to the package substrate 210.

Furthermore, a plurality of semiconductor elements 220 may be mountedover the package substrate 210. In addition, not only the semiconductorelement 220 but also another electronic part, such as a chip capacitor,may be mounted over the package substrate 210.

Next, a semiconductor package 300 illustrated in FIG. 5 will bedescribed.

A semiconductor package 300 illustrated in FIG. 5 includes a packagesubstrate (circuit board) 310, a semiconductor element 320 mounted overthe package substrate 310, and a covering material 330 which covers thesemiconductor element 320.

A printed board or the like is used as the package substrate 310. Thepackage substrate 310 includes a conductor portion (wirings and vias)311 formed by the use of Cu, Al, or the like, and an insulating portion312 which covers the conductor portion 311 and which is formed by theuse of a resin material or the like.

The semiconductor element 320 is electrically connected(flip-chip-bonded) to the above package substrate 310 by bumps 340 ofsolder or the like formed on the semiconductor element 320. A spacebetween the package substrate 310 and the semiconductor element 320 isfilled with an under-fill material 341. The semiconductor element 320over the package substrate 310 is covered with the covering material330. A heat conductive material, such as Cu, is used as the coveringmaterial 330. The covering material 330 is attached to the semiconductorelement 320 by the use of a thermal interface material (TIM) 350 and isthermally connected to the semiconductor element 320. For example, endportions of the covering material 330 are attached to the packagesubstrate 310 by the use of an adhesive 351.

The conductor portion 311 in the surface of the package substrate 310opposite the surface over which the semiconductor element 320 is mountedincludes portions used as terminals 311 a for external connection. Bumpsof solder or the like corresponding to the above joining material 30 a(FIGS. 2A through 2C) are put on the terminals 311 a when or before thesemiconductor package 300 is joined to another electronic part.

A plurality of semiconductor elements 320 may be mounted over thepackage substrate 310. In addition, not only the semiconductor element320 but also another electronic part, such as a chip capacitor, may bemounted over the package substrate 310.

Next, a semiconductor package 400 illustrated in FIG. 6 will bedescribed.

A semiconductor package 400 illustrated in FIG. 6 includes a resin layer410, a plurality of (two, in this example) semiconductor elements 420embedded in the resin layer 410, and a wiring layer (rewiring layer) 430formed over the resin layer 410.

Each semiconductor element 420 is embedded in the resin layer 410 sothat its surface in which a terminal 420 a is disposed will be exposed.The wiring layer 430 includes a conductor portion (rewirings and vias)431 formed by the use of Cu, Al, or the like, and an insulating portion432 which covers the conductor portion 431 and which is formed by theuse of a resin material or the like.

The conductor portion 431 in the surface of the wiring layer 430includes portions used as terminals 431 a for external connection. Theposition of a terminal 420 a of each semiconductor element 420 isrearranged by the conductor portion 431 at the position of a terminal431 a for external connection. Bumps of solder or the like correspondingto the above joining material 30 a (FIGS. 2A through 2C) are put on theterminals 431 a when or before the semiconductor package 400 is joinedto another electronic part.

One or three or more semiconductor elements 420 may be embedded in theresin layer 410. Furthermore, not only the semiconductor elements 420but also another electronic part, such as a chip capacitor, may beembedded in the resin layer 410.

Each of FIGS. 7A and 7B illustrates an example of the structure of acircuit board. Each of FIGS. 7A and 7B is a fragmentary schematicsectional view of an example of a circuit board.

In the example of FIG. 7A, a multilayer printed circuit board includinga plurality of wiring layers is illustrated as a circuit board 500. Thecircuit board 500 includes a conductor portion (wirings and vias) 511formed by the use of Cu, Al, or the like, and an insulating portion 512which covers the conductor portion 511 and which is formed by the use ofa resin material or the like. This is the same with the packagesubstrate 210 illustrated in FIG. 4 and the package substrate 310illustrated in FIG. 5.

The conductor portion 511 in the surfaces of the circuit board 500includes portions used as terminals 511 a for external connection. Bumpsof solder or the like corresponding to the above joining material 30 a(FIGS. 2A through 2C) are put on the terminals 511 a when or before thecircuit board 500 is joined to another electronic part.

In the example of FIG. 7B, a buildup board formed by the use of abuildup method is illustrated as a circuit board 600. The circuit board600 includes a core board 610, an insulating layer 620 formed over thecore board 610, conductor patterns 630 formed with the insulating layer620 between, and vias 640 which connect different conductor patterns630. A ceramic material, an organic material, or the like is used forforming the core board 610. An insulating material, such as prepreg, isused for forming the insulating layer 620. A conductive material, suchas Cu, is used for forming the conductor patterns 630 and the vias 640.

The conductor patterns 630 in the surfaces of the circuit board 600include portions used as terminals 630 a for external connection. Bumpsof solder or the like corresponding to the above joining material 30 a(FIGS. 2A through 2C) are put on the terminals 630 a when or before thecircuit board 600 is joined to another electronic part.

For example, the semiconductor element 100 illustrated in FIG. 3, thesemiconductor package 200 illustrated in FIG. 4, the semiconductorpackage 300 illustrated in FIG. 5, the semiconductor package 400illustrated in FIG. 6, the circuit board 500 illustrated in FIG. 7A, orthe circuit board 600 illustrated in FIG. 7B may be used as theelectronic part 10 or the electronic part 20 illustrated in FIGS. 1 and2A through 2C.

For example, a combination of the electronic part 10 and the electronicpart 20 to be joined together may be a combination of a semiconductorelement and a circuit board, a combination of a semiconductor packageand a circuit board, or a combination of a semiconductor element and asemiconductor package. Alternatively, a combination of the electronicpart 10 and the electronic part 20 to be joined together may be acombination of semiconductor elements, a combination of semiconductorpackages, or a combination of circuit boards.

By using the above joining method described in FIGS. 2A through 2C forjoining each of various combinations of the electronic part 10 and theelectronic part 20, the pole-like compounds 31 extending in thedirection in which the terminal 11 and the terminal 21 are opposite toeach other are formed in the joining portion 30 formed as a result ofthe solidification of the joining material 30 a. Accordingly, thestrength of the joining portion 30 improves. As a result, the appearanceof a crack or peel in the joining portion 30 caused by external force orstress or a disconnection caused by such a crack or peel is effectivelycontrolled.

A second embodiment will now be described.

Description will be given with a case where one of electronic parts tobe joined together is a circuit board, where the other is asemiconductor package, and where they are joined together by the use ofSn—Ag based solder as an example.

FIGS. 8A, 8B, and 8C illustrate an example of an electronic part joiningprocess according to a second embodiment. Each of FIGS. 8A, 8B, and 8Cis a fragmentary schematic sectional view of an example of an electronicpart joining process according to a second embodiment. FIG. 8Aillustrates an example of a state before joining. FIG. 8B illustrates anexample of a state at joining time. FIG. 8C illustrates an example of astate after joining.

In this case, first a circuit board 40 and a semiconductor package 50illustrated in FIG. 8A are prepared as electronic parts to be joinedtogether.

The circuit board 40 has a terminal 41 formed over a surface 40 a. Theterminal 41 includes an electrode layer 41 a formed by the use of Cu orthe like and, for example, a Ni—Au electrode layer 41 b formed over theelectrode layer 41 a and having a laminated structure of Ni and Au. Ajoining material 60 b which is, for example, Sn—Ag—Cu solder is put inadvance on the terminal 41 (electrode layer 41 b) of the circuit board40. The joining material 60 b is formed, for example, by applying solderpaste to the terminal 41 or depositing solder by plating.

The semiconductor package 50 is disposed opposite the circuit board 40and has a terminal 51 formed over a surface 50 a opposite the surface 40a of the circuit board 40. The terminal 51 includes an electrode layer51 a formed by the use of Cu or the like and, for example, a Ni—Auelectrode layer 51 b formed over the electrode layer 51 a. A joiningmaterial 60 a which is, for example, Sn—Ag—Cu solder is put in advanceon the terminal 51 (electrode layer 51 b) of the semiconductor package50. The joining material 60 a is formed, for example, by melting byheating solder put on the terminal by mounting a solder ball ordepositing solder by plating and by solidifying the solder by cooling.

A member 70A having determined heat capacity is disposed over a surface(upper surface) 50 b of the semiconductor package 50 opposite thesurface 50 a over which the terminal 51 is formed. A material havingheat capacity which makes the temperature of the semiconductor package50 over which the member 70A is disposed higher than that of the circuitboard 40 at the time of melting the joining material 60 a and thejoining material 60 b by heating and then solidifying them by cooling,as described later, is used as the member 70A. In order to make themember 70A have the determined heat capacity, a material (specific heat)is selected and its plane size and thickness are set. A plate of Cu, Al,or the like is used as the member 70A.

The member 70A is attached to the upper surface 50 b of thesemiconductor package 50 by the use of an adhesive such as resin ormetal paste (not illustrated in FIG. 8A, 8B, or 8C). The disposition ofthe member 70A over the semiconductor package 50 will be describedlater.

As illustrated in FIG. 8A, the terminal 41 (joining material 60 b) ofthe circuit board 40 over which the joining material 60 b is formed isaligned with the terminal 51 (joining material 60 a) of thesemiconductor package 50 over which the joining material 60 a is formedand over which the member 70A is disposed to dispose them opposite eachother.

As illustrated in FIG. 8B, the joining material 60 a on the terminal 51of the semiconductor package 50 is then melted by heating and isconnected to the joining material 60 b on the terminal 41 of the circuitboard 40 which is also melted. The joining material 60 a and the joiningmaterial 60 b are melted and connected in this way and are integratedwith each other. A portion (joining portion) 60 c formed by integratingthe joining material 60 a and the joining material 60 b with each otherin this way is solidified by cooling.

As stated above, the member 70A having the determined heat capacity isdisposed over the semiconductor package 50. In the process of coolingthe joining material 60 a and the joining material 60 b after heating,an adjustment is made by the member 70A so as to make the temperature ofthe semiconductor package 50 higher than that of the circuit board 40,for example, during a period from the beginning to the end of thesolidification of the joining material 60 a and the joining material 60b (joining portion 60 c).

The heat capacity of the semiconductor package over which the member 70Ais disposed is large compared with the semiconductor package 50 overwhich the member 70A is not disposed. Accordingly, when the joiningportion 60 c formed by melting the joining material 60 a and the joiningmaterial 60 b by heating and by integrating them with each other iscooled for solidification, the cooling rate of the semiconductor package50 over which the member 70A is disposed is lower than that of thesemiconductor package 50 over which the member 70A is not disposed. Thatis to say, the disposition of the member 70A makes it more difficult tocool the semiconductor package 50. For example, the cooling rate of thesemiconductor package 50 over which the member 70A is disposed is 1°C./min or less.

When the joining portion 60 c formed by melting the joining material 60a and the joining material 60 b by heating and by integrating them witheach other is cooled for solidification, not only the semiconductorpackage 50 but also the circuit board 40 is cooled. At this time acooling rate of the semiconductor package 50 falls because of thepresence of the member 70A. The semiconductor package 50 over which themember 70A is disposed is cooled slowly compared with the semiconductorpackage 50 over which the member 70A is not disposed. Meanwhile, thecircuit board 40 is cooled. As a result, the temperature of thesemiconductor package 50 over which the member 70A is disposed maybecome higher than that of the circuit board 40. The member 70A havingthe determined heat capacity is disposed so as to make the temperatureof the semiconductor package 50 over which the member 70A is disposed inthis way higher than that of the circuit board 40, for example, during aperiod from the beginning to the end of the solidification of thejoining portion 60 c.

The above member 70A is disposed and the temperature of thesemiconductor package 50 is made higher than that of the circuit board40. By doing so, a temperature gradient by which the temperature on thesemiconductor package 50 side is higher than that on the circuit board40 side is produced in the joining portion 60 c at solidification time.Such a temperature gradient is produced, so the solidification of thejoining portion 60 c usually progresses from the circuit board 40 sideat lower temperatures to the semiconductor package 50 side at highertemperatures.

The solidification progresses in this way. Accordingly, as illustratedin FIG. 8C, a pole-like compound 61 which is Ag₃Sn is formed in thejoining portion 60 c so that it will extend in the direction in whichthe solidification progresses, that is to say, in the direction in whichthe terminal 41 of the circuit board 40 and the terminal 51 of thesemiconductor package 50 are opposite to each other. In the example ofFIG. 8C, a plurality of pole-like compounds 61 are illustrated. However,the number or disposition of compounds 61 is not limited to that of thecompounds 61 illustrated in FIG. 8C. The pole-like compounds 61, whichare Ag₃Sn, are covered with a portion 62 which contains Sn, Ag, and Cucontained in the joining material 60 a and the joining material 60 b.With the progress of the solidification, a joining portion 60 whichcontains the pole-like compounds is formed inside the portion 62. As aresult, as illustrated in FIG. 8C, an electronic apparatus 1A in whichthe circuit board 40 and the semiconductor package 50 are joined by thejoining portion 60 is obtained.

The Ni layer included in each of the electrode layer 41 b of theterminal 41 and the electrode layer 51 b of the terminal 51 has thefunction of preventing a solder component of the joining portion 60 c orthe joining portion 60 from diffusing into the foundation electrodelayer 41 a or electrode layer 51 a formed by the use of Cu or the like.The Ni layer included in the electrode layer 41 b or the electrode layer51 b may react with a solder component of the joining portion 60 c orthe joining portion 60 to form an intermetallic compound. The Au layerincluded in the electrode layer 41 b or the electrode layer 51 b has thefunction of preventing the Ni layer before joining from oxidizing. TheAu layer included in the electrode layer 41 b or the electrode layer 51b may react at joining time with the solder component of the joiningportion 60 c or the joining portion 60 to form an intermetalliccompound.

As has been described, with the electronic apparatus 1A, as illustratedin FIG. 8C, the pole-like compounds 61 extending in the direction inwhich the terminal 41 and the terminal 51 are opposite to each other areformed in the joining portion 60 by which the terminal 41 of the circuitboard 40 and the terminal 51 of the semiconductor package 50 are joined.The pole-like compounds 61 function like metal reinforcements, so thestrength of the joining portion 60 against external force or stresscreated by heat improves. For example, the strength of the joiningportion 60 against stress created in a direction which intersects thedirection in which the pole-like compounds 61 extend improves. Byforming the pole-like compounds 61 in the joining portion 60, forexample, the lifetime of the joining portion 60 is two times or more aslong as that of the joining portion 60 in which the pole-like compounds61 are not formed in a repetitive bending test or a temperature cyclingtest.

The disposition of the member 70A having the determined heat capacityover the semiconductor package 50 will now be described with referenceto FIGS. 9, 10A, and 10B.

FIG. 9 illustrates a first example of the structure of an electronicapparatus according to the second embodiment. FIG. 9 is a fragmentaryschematic sectional view of a first example of the structure of anelectronic apparatus according to the second embodiment.

As in an electronic apparatus 1Aa illustrated in FIG. 9, a member 70A isdisposed over an upper surface 50 b of a semiconductor package 50 by theuse of an adhesive 80 a. For example, a resin material, such as epoxyresin, is used as the adhesive 80 a. Alternatively, for example, a metalpaste material, such as an indium-silver (InAg) alloy or a gold-tin(AuSn) alloy, is used as the adhesive 80 a.

The semiconductor package 50 to which the member 70A is attached inadvance by the use of the adhesive 80 a is prepared. As illustrated inFIGS. 8A through 8C, the prepared semiconductor package 50 is joined toa circuit board 40. As a result, as illustrated in FIG. 9, theelectronic apparatus 1Aa in which the semiconductor package 50 to whichthe member 70A is attached by the use of the adhesive 80 a and thecircuit board 40 are joined via a joining portion 60 which containspole-like compounds 61 is obtained. The member 70A attached to thesemiconductor package 50 in the electronic apparatus 1Aa is used, forexample, as a heat radiation member for radiating to the outside heatgenerated by the semiconductor package 50 at the time of using theelectronic apparatus 1Aa.

FIGS. 10A and 10B illustrate a second example of the structure of theelectronic apparatus according to the second embodiment. Each of FIGS.10A and 10B is a fragmentary schematic sectional view of a secondexample of the structure of the electronic apparatus according to thesecond embodiment.

In this example, as illustrated in FIG. 10A, a member 70A is attached toan upper surface 50 b of a semiconductor package 50 by the use of anadhesive 80 b. Ultraviolet curing resin is used as the adhesive 80 b.When ultraviolet curing resin is irradiated with ultraviolet rays, it iscured and its detachability appears (its adhesion weakens).

Ultraviolet curing resin is used as the adhesive 80 b and thesemiconductor package 50 to which the member 70A is attached(temporarily attached) in advance is prepared. As illustrated in FIGS.8A through 8C, the prepared semiconductor package 50 is joined to acircuit board 40. As a result, as illustrated in FIG. 10A, a structurein which the semiconductor package 50 to which the member 70A istemporarily attached by the use of the adhesive 80 b and the circuitboard 40 are joined via a joining portion 60 which contains pole-likecompounds 61 is obtained.

After this structure is obtained, the adhesive 80 b is irradiated withultraviolet rays. As a result, the detachability of the adhesive 80 bappears and a state in which the member 70A temporarily attached to thesemiconductor package 50 and the adhesive 80 b can be detached from thesemiconductor package 50 arises. The member 70A and the adhesive 80 b inthis state are removed from over the semiconductor package 50 and anelectronic apparatus 1Ab illustrated in FIG. 10B is obtained. As hasbeen described, the member 70A is temporarily attached to thesemiconductor package 50 at the time of the joining of the circuit board40 and the semiconductor package 50, and may be removed after thejoining of the circuit board 40 and the semiconductor package 50.

In the second embodiment a case where Sn—Ag based solder is used forforming the joining material 60 a and the joining material 60 b (joiningportion 60 c) and the joining portion 60 is taken as an example.However, the same applies in a case where Sn—Ni based solder, Sn—Cubased solder, Sn—Au based solder, Sn—Pd based solder, or the like isused. Furthermore, it is possible to form the above joining material 60b over the semiconductor package 50, form the above joining material 60a over the circuit board 40, and join the semiconductor package 50 andthe circuit board 40.

In the second embodiment the descriptions are given with a case wherethe circuit board 40 and the semiconductor package 50 are joined as anexample. However, the technique of using the above member 70A is alsoapplicable in cases where various electronic parts are joined.

A third embodiment will now be described.

In a third embodiment description will be given with a case where one ofelectronic parts to be joined is a circuit board, where the other is asemiconductor package, and where they are joined by the use of Sn—Agbased solder as an example. This is the same with the above secondembodiment.

FIGS. 11A, 11B, and 11C illustrate an example of an electronic partjoining process according to a third embodiment. Each of FIGS. 11A, 11B,and 11C is a fragmentary schematic sectional view of an example of anelectronic part joining process according to a third embodiment. FIG.11A illustrates an example of a state before joining. FIG. 11Billustrates an example of a state at joining time. FIG. 11C illustratesan example of a state after joining.

An electronic part joining process according a third embodimentillustrated in FIGS. 11A through 11C differs from the electronic partjoining process according the above second embodiment in that a member70B having determined heat capacity is disposed over a circuit board 40.

In the third embodiment, as illustrated in FIG. 11A, first the circuitboard 40 over which the member 70B is disposed and a semiconductorpackage 50 are prepared as electronic parts to be joined.

The circuit board 40 has a terminal 41 formed over a surface 40 a. Theterminal 41 includes an electrode layer 41 a formed by the use of Cu orthe like and an electrode layer 41 b formed by the use of, for example,Ni and Au. A joining material 60 b which is, for example, Sn—Ag—Cusolder is put in advance on the terminal 41 (electrode layer 41 b) ofthe circuit board 40.

The member 70B having the determined heat capacity is disposed over asurface (lower surface) 40 b of the circuit board 40 opposite thesurface 40 a over which the terminal 41 is formed. A material havingheat capacity which makes the temperature of the circuit board 40 overwhich the member 70B is disposed higher than that of the semiconductorpackage 50 at the time of melting a joining material 60 a and thejoining material 60 b by heating and then solidifying them by cooling,as described later, is used as the member 70B. In order to make themember 70B have the determined heat capacity, a material (specific heat)is selected and its plane size and thickness are set. A plate of Cu, Al,or the like is used as the member 70B.

The member 70B is disposed directly on the lower surface 40 b of thecircuit board 40. Alternatively, the member 70B may be disposed underthe lower surface 40 b of the circuit board 40 by the use of an adhesivesuch as resin (not illustrated in FIG. 11A, 11B, or 11C). Thedisposition of the member 70B under the circuit board 40 will bedescribed later.

The semiconductor package 50 is disposed opposite the circuit board 40and has a terminal 51 formed over a surface 50 a. The terminal 51includes an electrode layer 51 a formed by the use of Cu or the like andan electrode layer 51 b formed by the use of, for example, Ni and Au.The joining material 60 a which is, for example, Sn—Ag—Cu solder is putin advance on the terminal 51 (electrode layer 51 b) of thesemiconductor package 50.

As illustrated in FIG. 11A, the terminal 41 (joining material 60 b) ofthe circuit board 40 over which the joining material 60 b is put andunder which the member 70B is disposed is aligned with the terminal 51(joining material 60 a) of the semiconductor package 50 over which thejoining material 60 a is put to dispose them opposite each other.

As illustrated in FIG. 11B, the joining material 60 a on the terminal 51of the semiconductor package 50 is then melted by heating and isconnected to the joining material 60 b on the terminal 41 of the circuitboard 40 which is also melted. The joining material 60 a and the joiningmaterial 60 b are melted and connected in this way and are integratedwith each other. A joining portion 60 c formed by integrating thejoining material 60 a and the joining material 60 b with each other issolidified by cooling.

As stated above, the member 70B having the determined heat capacity isdisposed under the circuit board 40. In the process of cooling thejoining material 60 a and the joining material 60 b after heating, anadjustment is made by the member 70B so as to make the temperature ofthe circuit board 40 higher than that of the semiconductor package 50,for example, during a period from the beginning to the end of thesolidification of the joining portion 60 c.

The heat capacity of the circuit board 40 under which the member 70B isdisposed is large compared with the circuit board 40 under which themember 70B is not disposed. Accordingly, when the joining portion 60 cformed by melting the joining material 60 a and the joining material 60b and by integrating them with each other is cooled for solidification,the cooling rate of the circuit board 40 under which the member 70B isdisposed is lower than that of the circuit board 40 under which themember 70B is not disposed. That is to say, the disposition of themember 70B makes it more difficult to cool the circuit board 40. Forexample, the cooling rate of the circuit board 40 under which the member70B is disposed is 1° C./min or less.

When the joining portion 60 c is cooled for solidification, not only thecircuit board 40 but also the semiconductor package 50 is cooled. Atthis time the cooling rate of the circuit board 40 falls because of thepresence of the member 70B. The circuit board 40 under which the member70B is disposed is cooled slowly compared with the circuit board 40under which the member 70B is not disposed. Meanwhile, the semiconductorpackage 50 is cooled. As a result, the temperature of the circuit board40 under which the member 70B is disposed may become higher than that ofthe semiconductor package 50. The member 70B having the determined heatcapacity is disposed so as to make the temperature of the circuit board40 under which the member 70B is disposed in this way higher than thatof the semiconductor package 50, for example, during a period from thebeginning to the end of the solidification of the joining portion 60 c.

The above member 70B is disposed and the temperature of the circuitboard 40 is made higher than that of the semiconductor package 50. Bydoing so, a temperature gradient by which the temperature on the circuitboard 40 side is higher than that on the semiconductor package 50 sideis produced in the joining portion 60 c at solidification time. Such atemperature gradient is produced, so the solidification of the joiningportion 60 c usually progresses from the semiconductor package 50 sideat lower temperatures to the circuit board 40 side at highertemperatures.

The solidification progresses in this way. Accordingly, as illustratedin FIG. 11C, a pole-like compound 61 which is Ag₃Sn is formed in thejoining portion 60 c so that it will extend in the direction in whichthe solidification progresses, that is to say, in the direction in whichthe terminal 41 of the circuit board 40 and the terminal 51 of thesemiconductor package 50 are opposite to each other. In the example ofFIG. 11C, a plurality of pole-like compounds 61 are illustrated.However, the number or disposition of compounds 61 is not limited tothat of the compounds 61 illustrated in FIG. 11C. The pole-likecompounds 61, which are Ag₃Sn, are covered with a portion 62 whichcontains Sn, Ag, and Cu contained in the joining material 60 a and thejoining material 60 b. With the progress of the solidification, ajoining portion 60 which contains the pole-like compounds is formedinside the portion 62. As a result, as illustrated in FIG. 11C, anelectronic apparatus 1B in which the circuit board 40 and thesemiconductor package 50 are joined by the joining portion 60 isobtained.

As has been described, even if the member 70B having the determined heatcapacity is disposed under the circuit board 40, the pole-like compounds61 extending in the direction in which the terminal 41 of the circuitboard 40 and the terminal 51 of the semiconductor package 50 areopposite to each other are formed in the joining portion 60 by which theterminal 41 of the circuit board and the terminal 51 of thesemiconductor package 50 are joined. As a result, the electronicapparatus 1B in which the strength of the joining portion 60 againstexternal force or stress created by heat is improved is obtained. In theelectronic apparatus 1B, for example, the strength of the joiningportion 60 against stress created in a direction which intersects thedirection in which the pole-like compounds 61 extend is improved. Byforming the pole-like compounds 61 in the joining portion 60, forexample, the lifetime of the joining portion 60 is two times or more aslong as that of the joining portion 60 in which the pole-like compounds61 are not formed in a repetitive bending test or a temperature cyclingtest.

The disposition of the member 70B having the determined heat capacityunder the circuit board 40 will now be described.

To place the circuit board 40 on the member 70B is possible as one ofmethods for disposing the member 70B under the circuit board 40. In thiscase, the circuit board 40 is simply placed on the member 70B. There isno need to fix the circuit board 40 onto the member 70B, for example, byattaching the circuit board 40 by the use of an adhesive. As illustratedin FIGS. 11A through 11C, the semiconductor package 50 is joined to thecircuit board 40 placed in this way on the member 70B by the use of thejoining material 60 a and the joining material 60 b. A structure afterthe joining is picked up from the member 70B. As a result, theelectronic apparatus 1B without the member 70B in which the circuitboard 40 and the semiconductor package 50 are joined by the joiningportion 60 is obtained.

Furthermore, the member 70B may be disposed under the circuit board 40by the use of an adhesive. Such a method will be described withreference to FIGS. 12, 13A, and 13B.

FIG. 12 illustrates a first example of the structure of an electronicapparatus according to the third embodiment. FIG. 12 is a fragmentaryschematic sectional view of a first example of the structure of anelectronic apparatus according to the third embodiment.

If the circuit board 40 is a single-sided circuit board and does nothave a circuit pattern or a terminal for external connection on thelower surface 40 b, then the member 70B may be disposed under the lowersurface 40 b of the circuit board 40 by the use of an adhesive 80 a suchas a resin material or a metal paste material as illustrated in FIG. 12.The circuit board 40 to which the member 70B is attached in advance bythe use of the adhesive 80 a is prepared. As illustrated in FIGS. 11Athrough 11C, the prepared circuit board 40 and the semiconductor package50 are joined by the use of the joining material 60 a and the joiningmaterial 60 b. As a result, as illustrated in FIG. 12, an electronicapparatus 1Ba in which the semiconductor package 50 and the circuitboard 40 to which the member 70B is attached by the use of the adhesive80 a are joined via a joining portion 60 which contains pole-likecompounds 61 is obtained. The member 70B attached to the circuit board40 in the electronic apparatus 1Ba is used as a heat radiation memberfor radiating to the outside heat conducted to the circuit board 40 atthe time of using the electronic apparatus 1Ba.

FIGS. 13A and 13B illustrate a second example of the structure of theelectronic apparatus according to the third embodiment. Each of FIGS.13A and 13B is a fragmentary schematic sectional view of a secondexample of the structure of the electronic apparatus according to thethird embodiment.

In this example, as illustrated in FIG. 13A, an adhesive 80 b, which isultraviolet curing resin, is used for attaching a member 70B to a lowersurface 40 b of a circuit board 40. The circuit board 40 to which themember 70B is attached (temporarily attached) in advance by the use ofthe above adhesive 80 b is prepared and is joined, as illustrated inFIGS. 11A through 11C, to a semiconductor package 50 by the use of ajoining material 60 a and a joining material 60 b. As a result, asillustrated in FIG. 13A, a structure in which the semiconductor package50 and the circuit board 40 to which the member 70B is temporarilyattached by the use of the adhesive 80 b are joined via a joiningportion 60 which contains pole-like compounds 61 is obtained. Afterthat, the adhesive 80 b is irradiated with ultraviolet rays and themember 70B and the adhesive 80 b are removed from under the circuitboard 40 and an electronic apparatus 1Bb illustrated in FIG. 13B isobtained. As has been described, the member 70B is temporarily attachedto the circuit board 40 at the time of the joining of the circuit board40 and the semiconductor package 50, and may be removed after thejoining of the circuit board 40 and the semiconductor package 50.

In the third embodiment a case where Sn—Ag based solder is used forforming the joining material 60 a and the joining material 60 b (joiningportion 60 c) and the joining portion 60 is taken as an example.However, the same applies in a case where Sn—Ni based solder, Sn—Cubased solder, Sn—Au based solder, Sn—Pd based solder, or the like isused. Furthermore, it is possible to form the above joining material 60b over the semiconductor package 50, form the above joining material 60a over the circuit board 40, and join the semiconductor package 50 andthe circuit board 40.

In the third embodiment the descriptions are given with a case where thecircuit board 40 and the semiconductor package 50 are joined as anexample. However, the technique of using the above member 70B is alsoapplicable in cases where various electronic parts are joined.

A fourth embodiment will now be described.

In a fourth embodiment description will be given with a case where oneof electronic parts to be joined is a circuit board, where the other isa semiconductor package, and where they are joined by the use of Sn—Agbased solder as an example. This is the same with the above second orthird embodiment.

FIGS. 14A, 14B, and 14C illustrate an example of an electronic partjoining process according to a fourth embodiment. Each of FIGS. 14A,14B, and 14C is a fragmentary schematic sectional view of an example ofan electronic part joining process according to a fourth embodiment.FIG. 14A illustrates an example of a state before joining. FIG. 14Billustrates an example of a state at joining time. FIG. 14C illustratesan example of a state after joining.

In this example, as illustrated in FIG. 14A, first a circuit board 40and a semiconductor package 50 are prepared as electronic parts to bejoined.

The circuit board 40 has a terminal 41 formed over a surface 40 a. Theterminal 41 includes an electrode layer 41 a formed by the use of Cu orthe like and an electrode layer 41 b formed by the use of, for example,Ni and Au. A joining material 60 b which is, for example, Sn—Ag—Cusolder is put in advance on the terminal 41 (electrode layer 41 b) ofthe circuit board 40.

The semiconductor package 50 is disposed opposite the circuit board 40and has a terminal 51 formed over a surface 50 a. The terminal 51includes an electrode layer 51 a formed by the use of Cu or the like andan electrode layer 51 b formed by the use of, for example, Ni and Au. Ajoining material 60 a which is, for example, Sn—Ag—Cu solder is put inadvance on the terminal 51 (electrode layer 51 b) of the semiconductorpackage 50.

As illustrated in FIG. 14A, the terminal 41 (joining material 60 b) ofthe circuit board 40 over which the joining material 60 b is put isaligned with the terminal 51 (joining material 60 a) of thesemiconductor package 50 over which the joining material 60 a is put todispose them opposite each other.

As illustrated in FIG. 14B, the joining material 60 a on the terminal 51of the semiconductor package 50 is then melted by heating and isconnected to the joining material 60 b on the terminal 41 of the circuitboard 40 which is also melted. The joining material 60 a and the joiningmaterial 60 b are melted and connected in this way and are integratedwith each other. A joining portion 60 c formed by integrating thejoining material 60 a and the joining material 60 b with each other issolidified by cooling.

When the joining portion 60 c is cooled, one of the circuit board 40 andthe semiconductor package 50 is selectively cooled. In this case, forexample, the semiconductor package 50 is selectively cooled. Asillustrated in FIG. 14C, for example, air 91 is selectively sent to thesemiconductor package 50 by the use of a fan or the like to cool thesemiconductor package 50. The semiconductor package 50 is cooled in thisway by sending the air 91 thereto to raise its cooling rate.

When the joining portion 60 c is cooled for solidification, both of thecircuit board 40 and the semiconductor package 50 are cooled. At thistime the air 91 is selectively sent to the semiconductor package 50 toraise the cooling rate of the semiconductor package 50. As a result, thetemperature of the circuit board 40 may become higher than that of thesemiconductor package 50. The semiconductor package 50 is cooled bysending the air thereto in this way. By doing so, an adjustment is madeso as to make the temperature of the circuit board 40 higher than thatof the semiconductor package 50, for example, during a period from thebeginning to the end of the solidification of the joining portion 60 c.

The temperature of the circuit board 40 is made higher than that of thesemiconductor package 50. By doing so, a temperature gradient by whichthe temperature on the circuit board 40 side is higher than that on thesemiconductor package 50 side is produced in the joining portion 60 c atsolidification time. Such a temperature gradient is produced, so thesolidification of the joining portion 60 c usually progresses from thesemiconductor package 50 side at lower temperatures to the circuit board40 side at higher temperatures.

The solidification progresses in this way. Accordingly, as illustratedin FIG. 14C, a pole-like compound 61 which is Ag₃Sn is formed in thejoining portion 60 c so that it will extend in the direction in whichthe terminal 41 of the circuit board 40 and the terminal 51 of thesemiconductor package 50 are opposite to each other. In the example ofFIG. 14C, a plurality of pole-like compounds 61 are illustrated.However, the number or disposition of compounds 61 is not limited tothat of the compounds 61 illustrated in FIG. 14C. The pole-likecompounds 61, which are Ag₃Sn, are covered with a portion 62 whichcontains Sn, Ag, and Cu contained in the joining material 60 a and thejoining material 60 b. With the progress of the solidification, ajoining portion 60 which contains the pole-like compounds 61 is formedinside the portion 62. As a result, as illustrated in FIG. 14C, anelectronic apparatus 1C in which the circuit board 40 and thesemiconductor package 50 are joined by the joining portion 60 isobtained.

As has been described, the pole-like compounds 61 extending in thedirection in which the terminal 41 of the circuit board 40 and theterminal 51 of the semiconductor package 50 are opposite to each otherare also formed in the joining portion 60 between the circuit board 40and the semiconductor package 50 by the method of selectively sendingthe air 91 to the semiconductor package 50. As a result, the electronicapparatus 1C in which the strength of the joining portion 60 againstexternal force or stress created by heat is improved is obtained. In theelectronic apparatus 1C, for example, the strength of the joiningportion 60 against stress created in a direction which intersects thedirection in which the pole-like compounds 61 extend is improved.

Each of FIGS. 15 through 17 is a view for describing another example ofthe electronic part joining process according to the fourth embodiment.Each of FIGS. 15 through 17 is a fragmentary schematic sectional view ofanother example of the electronic part joining process according to thefourth embodiment.

FIG. 14C illustrates a case where the air 91 is selectively sent to thesemiconductor package 50, at the time of the joining portion 60 cillustrated in FIG. 14B being cooled for solidification, for cooling thesemiconductor package 50 and where the temperature of the circuit board40 is made higher than that of the semiconductor package 50 as anexample.

In addition, in order to make the temperature of the circuit board 40higher than that of the semiconductor package 50 at the time of thejoining portion 60 c illustrated in FIG. 14B being cooled forsolidification, the method of selectively applying heat 92 to thecircuit board 40 by the use of a heater or the like, as illustrated inFIG. 15, may be adopted. By applying the heat 92, the circuit board 40is heated and its cooling rate is lowered. This method is used forproducing in the joining portion 60 c at solidification time atemperature gradient by which the temperature on the circuit board 40side is higher than that on the semiconductor package 50 side. By doingso, the solidification of the joining portion 60 c usually progresses tothe circuit board 40 side. As a result, the above pole-like compounds 61which are Ag₃Sn are formed.

FIG. 14C illustrates the case where the air 91 is selectively sent tothe semiconductor package 50 as an example. As illustrated in FIG. 16,however, air 91 may be selectively sent to a circuit board 40 for makingthe temperature of a semiconductor package 50 higher than that of thecircuit board 40. In this case, as illustrated in FIGS. 14A and 14B,first the circuit board 40 and the semiconductor package 50 are disposedopposite each other, a joining material 60 a and a joining material 60 bare melted and connected, and a joining portion 60 c is formed. Afterthat, the joining portion 60 c is solidified by cooling. At cooling timethe air 91 is selectively sent to the circuit board 40 by the use of afan or the like to cool the circuit board 40. The circuit board 40 iscooled in this way by sending the air 91 thereto to raise its coolingrate. By doing so, the temperature of the semiconductor package 50 ismade higher than that of the circuit board 40, for example, during aperiod from the beginning to the end of the solidification of thejoining portion 60 c. This method is used for producing in the joiningportion 60 c at solidification time a temperature gradient by which thetemperature on the semiconductor package 50 side is higher than that onthe circuit board 40 side. As a result, the solidification of thejoining portion 60 c usually progresses to the semiconductor package 50side and the above pole-like compounds 61 which are Ag₃Sn are formed.

As illustrated in FIG. 17, in order to make the temperature on asemiconductor package 50 side higher than that on a circuit board 40side, the method of selectively applying heat 92 to the semiconductorpackage 50 by the use of a heater or the like may be adopted. Byapplying the heat 92 to the semiconductor package 50, the semiconductorpackage 50 is heated and its cooling rate is lowered. This method isused for producing in the joining portion 60 c at solidification time atemperature gradient by which the temperature on the semiconductorpackage 50 side is higher than that on the circuit board 40 side. As aresult, the above pole-like compounds 61 which are Ag₃Sn are formed.

In the fourth embodiment a case where Sn—Ag based solder is used forforming the joining material 60 a and the joining material 60 b (joiningportion 60 c) and a joining portion 60 is taken as an example. However,the same applies in a case where Sn—Ni based solder, Sn—Cu based solder,Sn—Au based solder, Sn—Pd based solder, or the like is used.Furthermore, it is possible to form the above joining material 60 b overthe semiconductor package 50, form the above joining material 60 a overthe circuit board 40, and join the semiconductor package 50 and thecircuit board 40.

In the fourth embodiment the descriptions are given with a case wherethe circuit board 40 and the semiconductor package 50 are joined as anexample. However, the technique of sending the air 91 or applying theheat 92 is also applicable in cases where various electronic parts arejoined.

The electronic apparatus 1, 1A (1Aa and 1Ab), 1B (1Ba and 1Bb), and 1Caccording to the above first through fourth embodiments, respectively,are fabricated, for example, by the use of the following fabricationapparatus. Description will now be given with a case where one ofelectronic parts to be joined is a circuit board 40 and where the otheris a semiconductor package 50 as an example.

FIG. 18 illustrates an example of an apparatus for fabricating anelectronic apparatus.

A fabrication apparatus 1000 illustrated in FIG. 18 includes adisposition section 1100, a heating section 1200, and a cooling section1300.

First the prepared circuit board 40 and semiconductor package 50 aretransported to the disposition section 1100, are aligned with each otherin the disposition section 1100, and are disposed opposite each otherthere. The prepared circuit board 40 and semiconductor package 50 are,for example, a circuit board 40 and a semiconductor package 50 overwhich a member 70A is disposed. Otherwise the prepared circuit board 40and semiconductor package 50 may be, for example, a circuit board 40under which a member 70B is disposed and a semiconductor package 50.Otherwise the prepared circuit board 40 and semiconductor package 50 maybe, for example, a circuit board 40 under which a member 70B is notdisposed and a semiconductor package 50 over which a member 70A is notdisposed. For convenience, the member 70A or the member 70B is notillustrated in FIG. 18.

The circuit board 40 and the semiconductor package 50 aligned with eachother are transported to the heating section 1200 located behind thedisposition section 1100, and are heated at a temperature correspondingto the types of a joining material 60 b and a joining material 60 aformed over the circuit board 40 and the semiconductor package 50respectively. This heating is performed in an atmosphere of an inertgas. In the heating section 1200, the joining material 60 b formed overthe circuit board 40 and the joining material 60 a formed over thesemiconductor package 50 are melted, are connected, and are integratedwith each other to form a joining portion 60 c. In the heating section1200, heating temperature may be raised by stages. That is to say,heating at a lower temperature (preheating) and heating at a highertemperature (main heating) may be performed.

The circuit board 40 and the semiconductor package 50 between which thejoining portion 60 c is formed by heating are transported to the coolingsection 1300 located behind the heating section 1200, and the joiningportion 60 c is solidified by cooling. This cooling is performed in anatmosphere of an inert gas.

The cooling section 1300 includes a temperature controller 1310 whichcontrols the entire temperature of an internal atmosphere by purge orthe like for cooling the circuit board 40, the semiconductor package 50,and the joining portion 60 c. In addition to the above temperaturecontroller 1310, the cooling section 1300 includes a temperaturecontroller 1320 located on the circuit board 40 side and a temperaturecontroller 1330 located on the semiconductor package 50 side. Thetemperature controller 1320 has, for example, an air sending function, aheating function, or both of them. The temperature controller 1330 has,for example, an air sending function, a heating function, or both ofthem.

If the prepared circuit board 40 and semiconductor package 50 are acircuit board 40 under which a member 70B is disposed and asemiconductor package 50 over which a member 70A is disposed, then thetemperature controller 1310 is used for performing the cooling and theformation of the joining portion 60 described in the above second orthird embodiment. In this case, there is no need to use the temperaturecontroller 1320 or the temperature controller 1330.

If the prepared circuit board 40 and semiconductor package 50 are acircuit board 40 under which a member 70B is not disposed and asemiconductor package 50 over which a member 70A is not disposed, thenthe temperature controller 1310 and the temperature controller 1320 orthe temperature controller 1330 are used. That is to say, thetemperature controller 1320 or the temperature controller 1330 is usedfor selectively heating or cooling one of the circuit board 40 and thesemiconductor package 50. As a result, the cooling and the formation ofthe joining portion 60 described in the above fourth embodiment areperformed.

For example, the fabrication apparatus 1000 whose structure isillustrated in FIG. 18 is used for fabricating the electronic apparatus1, 1A (1Aa and 1Ab), 1B (1Ba and 1Bb), and 1C according to the abovefirst through fourth embodiments respectively.

Examples are as follows.

Example 1

A Cu plate (member) is disposed over a rear of a semiconductor packagewhose plane size is 35 mm×35 mm. The Cu plate is equal in size to thesemiconductor package. The semiconductor package over the rear of whichthe Cu plate is disposed and a circuit board are then joined by the useof a Sn-3.0Ag-0.5Cu (3.0 wt % of Ag and 0.5 wt % of Cu) solder ball.This joining is performed for 2 minutes in an atmosphere of nitrogen (O₂concentration is 100 ppm or less) at temperature which is basically 217°C. and which does not exceed 245° C.

After it is ascertained that there is no problem about continuity of ajoining portion of an electronic apparatus obtained by joining thecircuit board and the semiconductor package in this way, the reliabilityof the joining portion is estimated. The rate of a rise in theresistance after 1000 cycles of a temperature cycling test from −40 to125° C. is 10 percent or less and a good result is obtained.Furthermore, after the electronic apparatus is left for 1000 hours in anenvironment in which the temperature is 121° C. and in which thehumidity is 85%, the rate of a rise in the resistance is 10 percent orless and a good result is obtained. This is the same with thetemperature cycling test. A section of the joining portion is observedby the use of an electron microscope. As a result, it is ascertainedthat a pole-like compound, which is Ag₃Sn, extending in a direction inwhich terminals of the circuit board and the semiconductor package areopposite to each other is formed between the terminals of the circuitboard and the semiconductor package.

Example 2

An Al plate (member) is disposed over a rear of a semiconductor packagewhose plane size is 35 mm×35 mm. The Al plate is equal in size to thesemiconductor package. The semiconductor package over the rear of whichthe Al plate is disposed and a circuit board are then joined by the useof a Sn-3.0Ag-0.5Cu (3.0 wt % of Ag and 0.5 wt % of Cu) solder ball.This joining is performed for 2 minutes in an atmosphere of nitrogen (O₂concentration is 100 ppm or less) at temperature which is basically 217°C. and which does not exceed 245° C.

After it is ascertained that there is no problem about continuity of ajoining portion of an electronic apparatus obtained by joining thecircuit board and the semiconductor package in this way, the reliabilityof the joining portion is estimated. The rate of a rise in theresistance after 1000 cycles of a temperature cycling test from −40 to125° C. is 10 percent or less and a good result is obtained.Furthermore, after the electronic apparatus is left for 1000 hours in anenvironment in which the temperature is 121° C. and in which thehumidity is 85%, the rate of a rise in the resistance is 10 percent orless and a good result is obtained. This is the same with thetemperature cycling test. A section of the joining portion is observedby the use of an electron microscope. As a result, it is ascertainedthat a pole-like compound, which is Ag₃Sn, extending in a direction inwhich terminals of the circuit board and the semiconductor package areopposite to each other is formed between the terminals of the circuitboard and the semiconductor package.

Example 3

A Cu plate (member) is disposed over a rear of a semiconductor packagewhose plane size is 35 mm×35 mm. The Cu plate is equal in size to thesemiconductor package. The semiconductor package over the rear of whichthe Cu plate is disposed and a circuit board are then joined by the useof a Sn-57Bi-1.0Ag (57 wt % of Bi and 1.0 wt % of Ag) solder ball. Thisjoining is performed for 3 minutes in an atmosphere of nitrogen (O₂concentration is 100 ppm or less) at temperature which is basically 139°C. and which does not exceed 210° C.

After it is ascertained that there is no problem about continuity of ajoining portion of an electronic apparatus obtained by joining thecircuit board and the semiconductor package in this way, the reliabilityof the joining portion is estimated. The rate of a rise in theresistance after 1000 cycles of a temperature cycling test from −40 to125° C. is 10 percent or less and a good result is obtained.Furthermore, after the electronic apparatus is left for 1000 hours in anenvironment in which the temperature is 121° C. and in which thehumidity is 85%, the rate of a rise in the resistance is 10 percent orless and a good result is obtained. This is the same with thetemperature cycling test. A section of the joining portion is observedby the use of an electron microscope. As a result, it is ascertainedthat a pole-like compound, which is Ag₃Sn, extending in a direction inwhich terminals of the circuit board and the semiconductor package areopposite to each other is formed between the terminals of the circuitboard and the semiconductor package.

Example 4

A Cu plate (member) is disposed under a rear of a circuit board. The Cuplate is equal in size to the circuit board. The circuit board under therear of which the Cu plate is disposed and a semiconductor package whoseplane size is 35 mm×35 mm are then joined by the use of a Sn-57Bi-1.0Ag(57 wt % of Bi and 1.0 wt % of Ag) solder ball. This joining isperformed for 3 minutes in an atmosphere of nitrogen (O₂ concentrationis 100 ppm or less) at temperature which is basically 139° C. and whichdoes not exceed 210° C.

After it is ascertained that there is no problem about continuity of ajoining portion of an electronic apparatus obtained by joining thecircuit board and the semiconductor package in this way, the reliabilityof the joining portion is estimated. The rate of a rise in theresistance after 1000 cycles of a temperature cycling test from −40 to125° C. is 10 percent or less and a good result is obtained.Furthermore, after the electronic apparatus is left for 1000 hours in anenvironment in which the temperature is 121° C. and in which thehumidity is 85%, the rate of a rise in the resistance is 10 percent orless and a good result is obtained. This is the same with thetemperature cycling test. A section of the joining portion is observedby the use of an electron microscope. As a result, it is ascertainedthat a pole-like compound, which is Ag₃Sn, extending in a direction inwhich terminals of the circuit board and the semiconductor package areopposite to each other is formed between the terminals of the circuitboard and the semiconductor package.

Example 5

A semiconductor package whose plane size is 35 mm×35 mm and a circuitboard are joined by the use of a Sn-57Bi-1.0Ag (57 wt % of Bi and 1.0 wt% of Ag) solder ball. This joining is performed for 3 minutes in anatmosphere of nitrogen (O₂ concentration is 100 ppm or less) attemperature which is basically 139° C. and which does not exceed 210° C.At cooling time N₂ is selectively blown on the semiconductor package.

After it is ascertained that there is no problem about continuity of ajoining portion of an electronic apparatus obtained by joining thecircuit board and the semiconductor package in this way, the reliabilityof the joining portion is estimated. The rate of a rise in theresistance after 1000 cycles of a temperature cycling test from −40 to125° C. is 10 percent or less and a good result is obtained.Furthermore, after the electronic apparatus is left for 1000 hours in anenvironment in which the temperature is 121° C. and in which thehumidity is 85%, the rate of a rise in the resistance is 10 percent orless and a good result is obtained. This is the same with thetemperature cycling test. A section of the joining portion is observedby the use of an electron microscope. As a result, it is ascertainedthat a pole-like compound, which is Ag₃Sn, extending in a direction inwhich terminals of the circuit board and the semiconductor package areopposite to each other is formed between the terminals of the circuitboard and the semiconductor package.

According to the disclosed art, the strength of a joining portionbetween electronic parts is increased and an electronic apparatusincluding a joining portion with high reliability is realized.

All examples and conditional language provided herein are intended forthe pedagogical purposes of aiding the reader in understanding theinvention and the concepts contributed by the inventor to further theart, and are not to be construed as limitations to such specificallyrecited examples and conditions, nor does the organization of suchexamples in the specification relate to a showing of the superiority andinferiority of the invention. Although one or more embodiments of thepresent invention have been described in detail, it should be understoodthat various changes, substitutions, and alterations could be madehereto without departing from the spirit and scope of the invention.

What is claimed is:
 1. An electronic apparatus comprising: a firstelectronic part with a first terminal; a second electronic part with asecond terminal opposite the first terminal; and a joining portion whichjoins the first terminal and the second terminal and which contains afirst pole-like compound extending in a direction in which the firstterminal and the second terminal are opposite to each other.
 2. Theelectronic apparatus according to claim 1, wherein the joining portionincludes a portion which covers the first compound, the portioncontaining a first element and a second element different from the firstelement, the first compound being an intermetallic compound containingthe first element and the second element.
 3. The electronic apparatusaccording to claim 1, wherein the joining portion contains the firstcompound and a second pole-like compound extending in the direction inwhich the first terminal and the second terminal are opposite to eachother.
 4. The electronic apparatus according to claim 3, wherein thejoining portion includes a portion which covers the first compound andthe second compound, the portion containing a first element and a secondelement different from the first element, each of the first compound andthe second compound being an intermetallic compound containing the firstelement and the second element.
 5. The electronic apparatus according toclaim 1 further comprising a first member which is disposed over thefirst electronic part and which has first heat capacity.
 6. Theelectronic apparatus according to claim 5, wherein the first member isseparate from the second electronic part.
 7. The electronic apparatusaccording to claim 5, wherein heat capacity of the first electronic partover which the first member is disposed is larger than heat capacity ofthe second electronic part.
 8. An electronic apparatus fabricationmethod comprising: preparing a first electronic part with a firstterminal; preparing a second electronic part with a second terminal; andmaking the first terminal and the second terminal opposite to each otherand joining the first terminal and the second terminal by the use of ajoining material, the joining the first terminal and the second terminalby the use of the joining material including: heating and melting thejoining material; and cooling and solidifying the joining material in astate in which temperature of the first electronic part is made higherthan temperature of the second electronic part.
 9. The electronicapparatus fabrication method according to claim 8 further comprisingdisposing over the first electronic part a first member having firstheat capacity after the preparing the first electronic part with thefirst terminal, wherein the joining the first terminal and the secondterminal by the use of the joining material includes joining the firstterminal of the first electronic part over which the first member isdisposed and the second terminal of the second electronic part.
 10. Theelectronic apparatus fabrication method according to claim 9 furthercomprising removing the first member after the joining the firstterminal and the second terminal by the use of the joining material. 11.The electronic apparatus fabrication method according to claim 10,wherein: the disposing the first member over the first electronic partincludes attaching the first member to the first electronic part by theuse of an adhesive; and the removing the first member includes weakeningadhesion of the adhesive and removing the first member from the firstelectronic part.
 12. The electronic apparatus fabrication methodaccording to claim 8, wherein the cooling and solidifying the joiningmaterial includes selectively cooling the second electronic part, of thefirst electronic part and the second electronic part, so as to make thetemperature of the first electronic part higher than the temperature ofthe second electronic part.
 13. The electronic apparatus fabricationmethod according to claim 8, wherein the cooling and solidifying thejoining material includes selectively heating the first electronic part,of the first electronic part and the second electronic part, so as tomake the temperature of the first electronic part higher than thetemperature of the second electronic part.
 14. An apparatus forfabricating an electronic apparatus, the apparatus comprising: adisposition section in which a first electronic part with a firstterminal and a second electronic part with a second terminal aredisposed with the first terminal and the second terminal opposite toeach other with a joining material between; a heating section which islocated behind the disposition section, in which the joining materialbetween the first terminal and the second terminal is melted by heating,and in which the first terminal and the second terminal are connected bythe melted joining material; and a cooling section which is locatedbehind the heating section and in which the melted joining materialbetween the first terminal and the second terminal is solidified bycooling, wherein the cooling section includes: a first temperaturecontroller which controls temperature of an atmosphere in the coolingsection; and a second temperature controller which is able toselectively control temperature of one of the first electronic part andthe second electronic part.